WebMay 20, 2015 · floor life. The allowable time period between removal of moisture-sensitive devices from a moisture barrier bag, dry storage, or dry bake and the solder reflow … Web3. The product floor life has expired (specified on the packaging label). Devices can be baked for 48 hours at 125°C. If device containers cannot be subjected to high temperatures, refer to Table 2 on page 3 for low-temperature bake requirements. Table 2 outlines the bake-out requirements specified in IPC/JEDEC standard J-STD-033
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